Applying High Performance Computing to Large Area Additive Manufacturing (LAAM) Systems

The primary objective of this effort is to scale or create new High-Performance Computing (HPC) modules capable of performing Artificial Intelligence (AI) / Machine Learning (ML) analytics, while simultaneously communicating with newly developed sensor frameworks that integrate with an extensive materials / process execution databank, creating a system / process that will allow the manufacture of more complete large scale additive manufacturing (AM) items. The intent is to be able to monitor AM related operations in real time to mitigate any print or manufacturing defects while they are occurring, which will improve the quality of the AM product and possibly save costs related to days of wasted manufacturing time, material, and resources.

11/10/2022: Request for White Papers Released
12/09/2022: White Papers Due
01/13/2023: Solution Selected
03/20/2023: Request for Proposal Released
03/28/2023: Proposal Submitted
06/02/2023: Awarded